Coining Technologies Inc. manufactures a wide variety standard, custom, and semi-custom dual-in-line package bases. These headers, made by coining, stamping or drawing processes are used widely in the semiconductor hermetic packaging industry. Coining Technologies has available tooling for thousands of combinations of OD’s, hole diameters and locations for glass-to-metal seal and ceramic-to-metal seal applications. Standard materials used for these packages include CRS, stainless steel, Kovar, Alloy 52, Alloy 42 and copper.