Coining MFG LLC is one of the world's largest producers of metal components for the semiconductor packaging industry. Our manufacturing techniques include coining, stamping, drawing, forming, blanking and CNC machining, EDM machining and Swiss Screw Machine turning. Our product line includes standard, custom and semi-custom configurations of metal components commonly used in hermetically sealed packages. Industry standard package outlines include:

  • TO (Transistor Outline)
  • DIL / DIP (Dual-in-Line)
  • SIP (Single in-line)
  • DO (Diode Outline)

Packaging and sealing methods used by our customers include glass-to-metal sealing, ceramic-to-metal sealing, brazing, soldering and welding.

Some of the materials used in packages include CRS, Stainless Steel, Kovar, Alloy 42, Alloy-52, Molybdenum, Copper-Tungsten, Copper, and Nickel.

We have over 5,000 standard tool combinations from which to choose. Our Engineering Department is ready to address your requirements for new design concepts. We work closely with our customers to quickly provide the best possible solutions to their needs. Your drawings, prints or designs can be sent to our Engineering department in Pro Engineer or AutoCAD format.